Browsing by Author Zhu, Zhiyuan

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Issue Date Title Author(s)
Oct-2022 Al-Sn-Al Bonding Strength Investigation Based on Deep Learning Model Jiang, Min;Yu, Min;Li, Bao;Zhang, Hongze;Zhu, Zhiyuan
2013 Aluminum-coated silicon wafer bonding with tin intermediate layer Zhu, Zhiyuan;Yu, Min;Tian, Dayu;Zhu, Yingwei;Wang, Peiquan;Liu, Chenchen;Wang, Wei;Miao, Min;Chen, Jing;Jin, Yufeng
2015 Bonding of copper surface in ambient air using propylene carbonate as passivation layer Zhu, Zhiyuan;Yu, Min;Phillips, Oluwadamilola;Liu, Lisha;Jin, Yufeng
2011 Design and Fabrication of a TSV Interposer for SRAM Integration Zhu, Yunhui;Ma, Shenglin;Cui, Qinghu;Kang, Wenping;Zhu, Zhiyuan;Sun, Xin;Wang, Guanjiang;Zhang, Mengmeng;Chen, Jing;Miao, Min;Jin, Yufeng
2012 Design and Optimization of a TSV 3D Packaged Pressure Sensor for High Temperature and Dynamic Measurement Liu, Zhenhua;Huang, Xian;Zhu, Zhiyuan;Chen, Jing;Jin, Yufeng
2012 Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection Ma, Shenglin;Sun, Xin;Zhu, Yunhui;Zhu, Zhiyuan;Cui, Qinghu;Chen, Meng;Xiao, Yongqiang;Chen, Jing;Miao, Min;Lu, Wengao;Jin, Yufeng
2012 Design and process development of a stacked SRAM memory chip module with TSV interconnection Ma, Shenglin;Sun, Xin;Zhu, Yunhui;Zhu, Zhiyuan;Cui, Qinghu;Chen, Meng;Xiao, Yongqiang;Chen, Jing;Miao, Min;Lu, Wengao;Jin, Yufeng
2012 Development of a Through-Stack-Via Integrated SRAM Module Zhu, Yunhui;Sun, Xin;Ma, Shenglin;Cui, Qinghu;Zhong, Xiao;Bian, Yuan;Chen, Meng;Xiao, Yongqiang;Fang, Runiu;Liu, Zhenhua;Zhu, Zhiyuan;Gong, Xin;Chen, Jing;Miao, Min;Lu, Wengao;Jin, Yufeng
2011 Electrical Characterization of Cylindrical and Annular TSV for Combined Application Thereof Sun, Xin;Cui, Qinghu;Zhu, Yunhui;Zhu, Zhiyuan;Miao, Min;Chen, Jing;Jin, Yufeng
2016 FABRICATION OF 1.5MM THICKNESS SILICON PIN FAST NEUTRON DETECTOR WITH GUARD RING STRUCTURE Zhang, Zhao;Yu, Min;Zhu, Zhiyuan;Wang, Hao;Huang, Yahuan;Jin, Yufeng
2016 Fabrication of 1.5mm thickness silicon pin fast neutron detector with guard ring structure Zhang, Zhao;Yu, Min;Zhu, Zhiyuan;Wang, Hao;Huang, Yahuan;Jin, Yufeng
15-Jul-2021 Fabrication of integrated silicon PIN detector based on Al-Sn-Al bonding for Delta E-E telescope application Zhu, Zhiyuan;Yu, Min;Jin, Yufeng
2011 The fatigue failure analysis of 3D SiP with Through Silicon Via Kang, Wenping;He, Yang;Zhu, Zhiyuan;Miao, Min;Chen, Jing;Jin, Yufeng
2011 Finite Element Stress Analysis of 3D TSV Stack Subject to Large Temperature Loading Zhu, Zhiyuan;Kang, Wenping;He, Yang;Zhu, Yunhui;Yu, Min;Miao, Min;Chen, Jing;Jin, Yufeng
2013 High Speed Test Structures for In-line Process of 3D System in Packaging Wang, Guanjiang;Zhu, Zhiyuan;Xu, Yichao;Fang, Runiu;Miao, Min;Jin, Yufeng
2015 Improvement of DRIE simulation method for process development application Du, Hong;Yu, Min;Qi, Lin;Zhu, Zhiyuan;Wang, Hao;Zhang, Haixia;Jin, Yufeng;Shi, Baohua;Zhang, Zhao
2015 Improvement of DRIE simulation method for process development application Du, Hong;Yu, Min;Qi, Lin;Zhu, Zhiyuan;Wang, Hao;Zhang, Haixia;Jin, Yufeng;Shi, Baohua;Zhang, Zhao
2013 Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration Zhu, Zhiyuan;Wang, Shaonan;Xu, Yichao;Wang, Guanjiang;Pi, Yudan;Wang, Peiquan;Zhu, Yunhui;Sun, Xin;Yu, Min;Chen, Jing;Miao, Min;Jin, Yufeng
2017 Investigations of silicon wafer bonding utilizing sputtered Al and Sn films Zhu, Zhiyuan;Yu, Min;Jin, Yufeng
2012 Low temperature Al based wafer bonding using Sn as intermediate layer Zhu, Zhiyuan;Yu, Min;Zhu, Yingwei;Wang, Peiquan;Liu, Chenchen;Wang, Wei;Miao, Min;Chen, Jing;Jin, Yufeng
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