Browsing by Author Deng, Kangfa
Showing results 1 to 4 of 4
Issue Date |
Title |
Author(s) |
2014 |
Benzo-cyclo-butene bonding process with 'stamp' printing for wafer level package |
Xia, Wen;Li, Lei;Deng, Kangfa;Li, Song;Su, Weiguo;Zhang, Wei |
2014 |
A convenient wafer level bonding based on unpatterned BCB |
Li, Lei;Deng, Kangfa;Xia, Wen;Zhu, Ningli;Li, Song;Su, Weiguo;Zhang, Wei |
2013 |
Inertial micro-switch capable of prolonging contact time |
Deng, Kangfa;Su, Weiguo;Li, Song;Zhang, Yating;Zhang, Wei |
2012 |
Study on Flow Behavior of BCB in Adhesive Bonding Aiming at Reducing Transverse Deformation |
Deng, Kangfa;Zheng, Huan;Jiang, Shaobo;Zhang, Wei |