| Title | Low power consumption physics package for chip-scale atomic clock through gold-tin eutectic bonding |
| Authors | Guo, Ping Meng, Hongling Dan, Lin Zhao, Jianye |
| Affiliation | Peking Univ, Dept Elect, Beijing 100871, Peoples R China Zhongkeqidi Optoelect Technol Guangzhou Co Ltd, Guangzhou 510700, Peoples R China |
| Keywords | CONTRAST DARK RESONANCES VAPOR-CELL D-1 LINE TRANSITIONS |
| Issue Date | Jun-2022 |
| Publisher | MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS |
| Abstract | Reducing power consumption of chip-scale atomic clocks (CSACs) is a common goal for researchers. An effective but challenging issue for this goal is the reduction of power dissipation of the physics package. Here, we analyze the power consumption through thermal conduction, radiation and convection of a microelectromechanical systems (MEMS) cell physics package for CSACs. The physics package consisting of small coefficient of thermal conductivity and emissivity materials is proposed, which is vacuum sealed by gold-tin eutectic bonding. The helium leak rate is measured to be 4 x 10(-11) Pa center dot m(3)/s. Thus, the physics package could keep high vacuum for about 3 years. The total power consumption of the proposed physics package is measured to be less than 20 mW. And the vacuum packaging also improves the frequency stability performance of CSACs, due to the increased insensitivity to ambient temperature change. The frequency performance of the prototype CSAC is improved from 8.8 x 10(-12) @1000 s to 5.38 x 10(-12)@1000 s. The results show that the gold-tin eutectic bonding can be used as vacuum packaging for MEMS devices. |
| URI | http://hdl.handle.net/20.500.11897/648043 |
| ISSN | 0946-7076 |
| DOI | 10.1007/s00542-022-05283-y |
| Indexed | EI SCI(E) |
| Appears in Collections: | 电子学院 |
