Title The numerical modeling of the vapor bubble growth on the silicon substrate inside the flat plate heat pipe
Authors Cui, Yifan
Yu, Huiyu
Wang, Huajie
Wang, Zhenyu
Yan, Xiulan
Affiliation Peking Univ, Sch Software & Microelect, Beijing 102600, Peoples R China
Peking Univ, Inst Geog Sci & Nat Resources Res, Key Lab Land Surface Pattern & Simulat, Beijing 100029, Peoples R China
Keywords POTENTIAL FUNCTIONS
LIQUID
POOL
FLOW
DYNAMICS
PERFORMANCE
SIMULATION
SURFACES
FLUX
VISUALIZATION
Issue Date Feb-2020
Publisher INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Abstract Inside the flat plate heat pipes for the microelectronics packages, the micro scale boiling is a common phenomenon under the suddenly high heat flux. The internal vast vapor bubble nucleation and growth become a challenge for the stable operations. Due to the lack of the direct observations, the vapor bubble growth in early stage is still unclear. In order to study the initial bubble growth, the molecular dynamics models of water-silicon interfaces which have different sizes of simulation boxes were examined. The vapor bubble diameter growth rates (0.18 +/- 0.02 x 10(6) mm/s) were calculated among the different sizes of simulation boxes. Since the lack of extra energy input, the initial vapor bubble can only expand to 45 nm diameter large (under 100 W/cm(2) heat flux at 350 K initial temperature). The growth phenomena of 0.1 mu m to 0.3 mm scale bubbles could be further modeled by the Mixture models. The observed bubble (bubble diameter between 10 mu m and 0.3 mm) had a diameter growth of 0.71 +/- 0.19 mm/s that was close to the Mixture model simulated one (0.75 mm/s). In addition, the ratio of the bubble volume growth rate to the bubble covered bottom area was about 7 +/- 0.2 mm/s. By calculating the ratio between the growth rate of observed bubbles and volume of the simulated stable nucleation bubble, the bubble generation rate (3 x 10(14) bubble/s mm(2)) under certain conditions might be estimated. Therefore, the whole process of bubbles growth could be deduced. (C) 2019 Elsevier Ltd. All rights reserved.
URI http://hdl.handle.net/20.500.11897/585096
ISSN 0017-9310
DOI 10.1016/j.ijheatmasstransfer.2019.118945
Indexed SCI(E)
Scopus
EI
Appears in Collections: 软件与微电子学院

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