Title Analysis and modeling of geometry dependent thermal resistance in silicon-on-insulator metal-oxide-semiconductor field-effect transistors
Authors Zhou, Xingye
Inoue, Takuya
Kitamura, Masashi
Matsuura, Kai
Miyake, Masataka
Iizuka, Takahiro
Umeda, Takuya
Kikuchihara, Hideyuki
Mattausch, Hans Juergen
He, Jin
Miura-Mattausch, Mitiko
Affiliation Advanced Sciences of Matter, Hiroshima University, Higashihiroshima, Hiroshima 739-8530, Japan
Electronic Engineering and Computer Science, Peking University, Beijing 100871, P. R., China
SoC Key Laboratory, Peking University, Shenzhen 518057, P. R, China
Issue Date 2013
Citation 2013,52(4 PART 2).
Abstract It is demonstrated that the self-heating effect easily causes elevated thermal equilibrium condition within the active device for thin substrate MOSFETs. This leads to a non-linearity of the thermal resistance, which originally is a material specific constant. A compact model for describing the observed effective nonlinear thermal resistance has been developed which captures the device geometry effects as well as the bias condition dependences. ? 2013 The Japan Society of Applied Physics.
URI http://hdl.handle.net/20.500.11897/461397
DOI 10.7567/JJAP.52.04CC29
Indexed EI
Appears in Collections: 信息科学技术学院

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