| Title | DEEP TRENCH REFILLING WITH PARYLENE C FOR HIGH-QUALITY ISOLATION IN BULK MICROMACHINED DEVICES |
| Authors | Lei, Yinhua Wang, Wei Yu, Huaiqiang Li, Ting Jin, Yufeng Zhang, Haixia Li, Zhihong |
| Affiliation | Peking Univ, Inst Microelect, Natl Key Lab Nano Micro Fabricat Technol, Beijing 100871, Peoples R China. |
| Keywords | ISOLATION TECHNOLOGY FABRICATION MEMS |
| Issue Date | 2008 |
| Citation | MICRONANO2008-2ND INTERNATIONAL CONFERENCE ON INTEGRATION AND COMMERCIALIZATION OF MICRO AND NANOSYSTEMS, PROCEEDINGS.. |
| Abstract | Isolation is usually a key factor that requires serious considerations in developing an integrated MEMS device. Here a deep trench refilling technology with parylene C was proposed to get high-quality isolation performance in bulk micro-machined devices. A 7 mu m wide and 50 mu m deep trench was etched on silicon and then refilled with parylene C to work as the functional component. A multi-step etching-refilling process was tested to improve the refilling performance. Based on primary experimental results, the trench was nearly filled by parylene C with a keyhole width less than 1.0 mu m. Combined with a backside slicing/etching process, the suspended trench exhibited an excellent mechanical connection performance with a breaking strength larger than 200 kPa. The present parylene C refilling technique could be a promising choice for both electrical and thermal isolation in bulk micromachined silicon devices. |
| URI | http://hdl.handle.net/20.500.11897/293691 |
| DOI | 10.1115/MicroNano2008-70112 |
| Indexed | EI CPCI-S(ISTP) |
| Appears in Collections: | 信息科学技术学院 |
