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| Issue Date | Title | Author(s) |
| 2018 | Batch-Mode mu USM Process for Surrounding Air Cavity and TCV Holes of AlN Ceramic Substrate Application for Patch Antenna | Xia, Yanming; Ma, Shenglin; Song, Lu; Wang, Tao; Wang, Zetian; Li, Xuanyang; Chen, Jing; Jin, Yufeng; Wang, Wei |
| 2016 | Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer | Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng |
| 2015 | Design, Fabrication and Stress Evaluation of Si Electrical Interconnection Air-gapped from Si Interposer | Ma, Shenglin; Xia, Yanming; Luo, Rongfeng; Ren, Kuili; Chen, Jing; Jin, Yufeng; Su, Fei |
| 2015 | Design, fabrication and stress evaluation of Si electrical interconnection Air-gapped from Si interposer | Ma, Shenglin; Xia, Yanming; Luo, Rongfeng; Ren, Kuili; Chen, Jing; Jin, Yufeng; Su, Fei |
| 2019 | Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration | Cai, Han; Yan, Jun; Ma, Shenglin; Luo, Rongfeng; Xia, Yanming; Li, Jiwei; Hu, Liulin; He, Shuwei; Tang, Zhongjun; Jin, Yufeng; Wang, Wei; Chen, Jing |
| 2016 | Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology | Ma, Shenglin; Xia, Yanming; Wang, Yaohua; Ren, Kuili; Luo, Rongfeng; Song, Lu; Chen, Xian; Chen, Jing; Jin, Yufeng |
| 2018 | Fabrication and characterization of AlN based Piezoelectric Micromachined Ultrasonic Transducer for contact sensing | Gong, Dan; Cai, Han; Xia, Yanming; Ma, Shenglin; HuanLiu; Chiu, Yihsiang; Jin, Yufeng |
| 2016 | Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package | Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang |
| 2018 | Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices | Yan, Jun; Ma, Shenglin; Jin, Yufeng; Wang, Wei; Chen, Jing; Luo, Rongfeng; Cai, Han; Li, Jiwei; Xia, Yanming; Hu, Lilin; He, Shuwei; Tang, Zhongjun |
| 2015 | Fabrication of Microchannel Embedded TSV Interposer and its Influence on TSV's Electrical Parameters | Xia, Yanming; Ma, Shenglin; Qin, Lifeng; Jin, Yufeng; Chen, Jing |
| 2015 | Fabrication of Microchannel embedded TSV interposer and its influence on TSV's electrical parameters | Xia, Yanming; Ma, Shenglin; Qin, Lifeng; Jin, Yufeng; Chen, Jing |
| 2018 | FABRICATION OF POLYMER MICRONEEDLE ARRAY BASED ON TUNGSTEN MOLD AND OPTIMIZED REPLICATION METHOD | Song, Lu; Xia, Yanming; Li, Xuanyang; Chen, Jing; Ma, Shenglin |
| Oct-2022 | A Glass-Ultra-Thin PDMS Film-Glass Microfluidic Device for Digital PCR Application Based on Flexible Mold Peel-Off Process | Xia, Yanming; Chu, Xianglong; Zhao, Caiming; Wang, Nanxin; Yu, Juan; Jin, Yufeng; Sun, Lijun; Ma, Shenglin |
| 1-Oct-2022 | Inductively coupled plasma etching of bulk tungsten for MEMS applications | Xia, Yanming; Wang, Zetian; Song, Lu; Wang, Wei; Chen, Jing; Ma, Shenglin |
| 2017 | MASS FABRICATION OF FLEXIBLE PIECES WITH HYDROPHOBIC SURFACE FOR UNDERWATER VEHICLE COATING | Song, Lu; Chen, Jing; Xu, Lijun; Wang, Zhenyu; Zhu, Ningli; Xia, Yanming; Ma, Shenglin |
| 2018 | Microwell as a biomedical device | Wang, Zetian; Li, Xuanyang; Chen, Jing; Xia, Yanming |
| 2016 | Process Development and Characterization for Integrating Microchannel into TSV Interposer | Xia, Yanming; Ren, Kuili; Ma, Shenglin; Luo, Rongfeng; Yan, Jun; Jin, Yufeng; Chen, Jing |
| 2016 | Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device | Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing |
| 2016 | Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices | Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing |
| 2016 | Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications | Yan, Jun; Ma, Shenglin; Ma, Feilong; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing |
