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| Issue Date | Title | Author(s) |
| 2018 | A 2.5D integrated L band Receiver based on High resistivity Si interposer | Ma, Shenglin; Chai, Yuan; Yan, Jun; Cai, Han; Hu, Liulin; He, Shuwei; Wang, Wei; Chen, Jing; Jin, Yufeng |
| Dec-2021 | An alN-based piezoelectric micromachined ultrasonic transducer with a double-beam suspended structure | Chiu, Yihsiang; Wang, Li; Gong, Dan; Yang, Yang; Wang, Weili; Li, Nan; Ma, Shenglin; Jin, Yufeng |
| 2018 | Batch-Mode mu USM Process for Surrounding Air Cavity and TCV Holes of AlN Ceramic Substrate Application for Patch Antenna | Xia, Yanming; Ma, Shenglin; Song, Lu; Wang, Tao; Wang, Zetian; Li, Xuanyang; Chen, Jing; Jin, Yufeng; Wang, Wei |
| 2009 | Bottom-up Filling of Through Silicon Via (TSV) with Parylene as Sidewall Protection Layer | Miao, Min; Zhu, Yunhui; Ji, Ming; Ma, Shenglin; Sun, Xin; Jin, Yufeng |
| 2008 | A Bulk Micromachined Cantilever Array for Uncooled Infrared Imaging | Yi, Yuliang; Ma, Shenglin; Yu, Xiaomei; Liu, Ming; Liu, Xiaohua |
| Apr-2023 | Chinese expert consensus on the diagnosis and treatment of thymic epithelial tumors | Xu, Chunwei; Zhang, Yongchang; Wang, Wenxian; Chu, Qian; Li, Ziming; Song, Zhengbo; Wang, Jiandong; Yu, Jinpu; Liu, Jingjing; Zhang, Shirong; Cai, Xiuyu; Wu, Ming; Zhan, Ping; Liu, Hongbing; Lv, Tangfeng; Miao, Liyun; Min, Lingfeng; Li, Jiancheng; Liu, Baogang; Yuan, Jingping; Jiang, Zhansheng; Lin, Gen; Chen, Xiaohui; Pu, Xingxiang; Rao, Chuangzhou; Lv, Dongqing; Yu, Zongyang; Li, Xiaoyan; Tang, Chuanhao; Zhou, Chengzhi; Zhang, Junping; Guo, Hui; Chu, Qian; Meng, Rui; Liu, Xuewen; Wu, Jingxun; Hu, Xiao; Fang, Min; Kang, Jin; Zhu, Zhengfei; Chen, Xiaofeng; Pan, Weiwei; Pang, Fei; Zhou, Yuxiang; Jian, Qijie; Wang, Kai; Wang, Liping; Zhu, Youcai; Yang, Guocai; Lin, Xinqing; Cai, Jing; Liang, Lijun; Feng, Huijing; Wang, Lin; Du, Yingying; Yao, Wang; Shi, Xuefei; Niu, Xiaomin; Yuan, Dongmei; Yao, Yanwen; Huang, Jianhui; Zhang, Yinbin; Sun, Pingli; Wang, Hong; Ye, Mingxiang; Wang, Dong; Wang, Zhaofeng; Hao, Yue; Wang, Zhen; Wan, Bing; Lv, Donglai; Yu, Genhua; Li, Anna; Kang, Jin; Zhang, Jiatao; Zhang, Chao; Chen, Huafei; Wu, Lin; Ye, Leiguang; Wang, Gaoming; Wang, Yina; Gao, Feng; Zhou, Wei; Hu, Chunxiu; Wei, Jianguo; Li, Bihui; Li, Zhongwu; Li, Yuan; Liu, Zhefeng; Yang, Nong; Wu, Lin; Wang, Qiming; Huang, Wenbin; Hong, Zhuan; Wang, Guansong; Fang, Meiyu; Song, Yong; Zhu, Xixu; Du, Kaiqi; Ji, Jiansong; Shen, Yi; Zhang, Yiping; Ma, Shenglin; Song, Yong; Lu, Yuanzhi; Liu, Anwen; Fang, Wenfeng; Zhong, Wenzhao |
| 2016 | Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer | Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng |
| 2020 | Design and Fabrication of 3D Interconnected Transmission Structure Based on TSV | Sun, Yunheng; Jin, Yufeng; Lian, Tingting; Li, Jiwei; Ma, Shenglin; Yang, Yuchi; Wang, Wei; Chen, Jing; He, Shuwei; Hu, Liulin |
| 2008 | Design and fabrication of a high sensitivity focal plane array for uncooled IR imaging | Yu, Xiaomei; Yi, Yuliang; Ma, Shenglin; Liu, Ming; Liu, Xiaohua; Dong, Liquan; Zhao, Yuejin |
| 2011 | Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC | Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Cui, Qinghu; Jin, Yufeng; Yu, Xiaomei; Chen, Jing; Miao, Min |
| 2011 | Design and Fabrication of a TSV Interposer for SRAM Integration | Zhu, Yunhui; Ma, Shenglin; Cui, Qinghu; Kang, Wenping; Zhu, Zhiyuan; Sun, Xin; Wang, Guanjiang; Zhang, Mengmeng; Chen, Jing; Miao, Min; Jin, Yufeng |
| 2008 | Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging | Ma, Shenglin; Yi, Yuliang; Tang, Yaquan; Yu, Xiaomei |
| 2012 | Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection | Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng |
| 2012 | Design and process development of a stacked SRAM memory chip module with TSV interconnection | Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng |
| 2020 | Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers | Sun, Yunheng; Jin, Yufeng; Lian, Tingting; Ma, Shenglin; Yang, Yuchi; Wang, Wei; Hu, Liulin; He, Shuwei |
| 2015 | Design, Fabrication and Stress Evaluation of Si Electrical Interconnection Air-gapped from Si Interposer | Ma, Shenglin; Xia, Yanming; Luo, Rongfeng; Ren, Kuili; Chen, Jing; Jin, Yufeng; Su, Fei |
| 2015 | Design, fabrication and stress evaluation of Si electrical interconnection Air-gapped from Si interposer | Ma, Shenglin; Xia, Yanming; Luo, Rongfeng; Ren, Kuili; Chen, Jing; Jin, Yufeng; Su, Fei |
| 2019 | Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration | Cai, Han; Yan, Jun; Ma, Shenglin; Luo, Rongfeng; Xia, Yanming; Li, Jiwei; Hu, Liulin; He, Shuwei; Tang, Zhongjun; Jin, Yufeng; Wang, Wei; Chen, Jing |
| 2013 | Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module | Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng |
| 2012 | Development of a Through-Stack-Via Integrated SRAM Module | Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng |
