| Issue Date | Title | Author(s) |
| Apr-2020 | Automatic Identification of Breast Ultrasound Image Based on Supervised Block-Based Region Segmentation Algorithm and Features Combination Migration Deep Learning Model | Liao, Wen-Xuan; He, Ping; Hao, Jin; Wang, Xuan-Yu; Yang, Ruo-Lin; An, Dong; Cui, Li-Gang |
| Oct-2020 | Comparison of two high temperature treatment methods on preparing electrically conductive polysulfide/Ag composites for aerospace sealant applications | Li, Jiaxiong; Song, Bo; An, Dong; Ren, Yanjuan; Hah, Jinho; Wang, Xueqiao; Zhang, Rong; Moon, Kyoung-sik; Wong, Ching-Ping |
| Nov-2021 | Design and analysis of a novel tendon-driven continuum robotic dolphin | Liu, Jincun; Zhang, Chi; Liu, Zhenna; Zhao, Ran; An, Dong; Wei, Yaoguang; Wu, Zhengxing; Yu, Junzhi |
| 20-Oct-2020 | Enhanced thermal conductivity in polyamide 6 composites based on the compatibilization effect of polyether-grafted graphene | Ren, Yanjuan; Ren, Liucheng; Li, Jiaxiong; Lv, Ruicong; Wei, Linfeng; An, Dong; Maqbool, M.; Bai, Shulin; Wong, Ching-Ping |
| 1-Mar-2020 | Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivity | An, Dong; Cheng, Shuaishuai; Xi, Shuang; Zhang, Zhiyi; Duan, Xiaoyuan; Ren, Yanjuan; Li, Jiaxiong; Sun, Zhijian; Liu, Yaqing; Wong, Ching-Ping |
| 2017 | On equilibrium configurations of nematic liquid crystals droplet with anisotropic elastic energy | An, Dong; Wang, Wei; Zhang, Pingwen |
| 2019 | A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connections | An, Dong; Cheng, Shuaishuai; Zhang, Zhiyi; Jiang, Can; Fang, Haoming; Li, Jiaxiong; Liu, Yaqing; Wong, Ching-Ping |
| 13-Oct-2020 | Stochastic Constrained Extended System Dynamics for Solving Charge Equilibration Models | Tan, Songchen; Leven, Itai; An, Dong; Lin, Lin; Head-Gordon, Teresa |
| 8-May-2020 | Systematic evaluation of cyanate ester/epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications | Li, Jiaxiong; Ren, Chao; An, Dong; Ren, Yanjuan; Moon, Kyoung-sik; Wong, Ching-ping |
